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2008年9月12日 星期五

[Tech.] Notices for Screen-Printing on PET

The PTF (Polymer Thick Film) uses silkscreen to print the silver and carbon combination conductive inks on PET (Polyethylene terephthalate) substitute to reach low cost purpose as compare with FPC (Flexibility printing Circuit). Unfortunately, the screen-printing has some ability limits.

Below are my experiences to show you some notices for the screen-printing process.

  • Foreign particle contamination: The particle may come from the air or inks, include conductive and dielectric inks. In order to control the particle around the air, A 100K class of clean room is preferable for screen-printing process fields. Using filter to screen out big particle inside inks is also recommended.
    You can image the insulation particle locates on the circuit trace will bring the trace open or increase the resistance. The conductive particle locates between the circuit traces will make trace short. Especially, while you are manufacturing the fine pitch, pitch less than 16 mils (0.4mm), products.
    If the particle come from inks then it may clog the mesh of silkscreen template then bring the printing skip and result circuit open. Sometimes particle will pierce the dielectric layer between conductive layers and bring the circuit short between conductive layers.
  • Printing smear on circuits layer: Printing smear defect is a commonly problem for screen-printing process. It will make short between circuits once the smear cross to adjacent circuit traces. Especially for fine pitch products. Sometimes you hard to detect this kind of defect by test fixture and it will show up circuit short defect after it install unit for a period. it is highly suspected the electromigration happens between circuit traces.
    It better to clean the silkscreen template regularly base on actual status and check the printing result every layer after every circuits printing. It will be good if factory can implement the AOI (Auto Optical Inspector) equipment to inspect  printing quality.
    PTF_Print_smear_s
    (↑The printing smear between circuits and bring electric short after environmental test. Using knife to cut off the smear area then PTF back to work.)
  • Printing voids  on dielectric layer: There are some tiny voids under screen-printing ink. Once the voids locate on the circuits between two conductive then it may bring circuit short. My experience show the eletromigration will grow dendrite between the layers of  circuits through  voids if you give voltage as engine and moisture as accelerator.
    silkscreen_mesh02
    You may reduce the viscosity for dielectric ink to solve the dielectric voids. Printing two or three dielectric layers between electric circuits and using different screen template with different mesh count and angle to cover the voids are preferred.

More article:
PTF(Polymer Tick Film) introduction
Hot-Bar FPC Design Notices

2008年9月5日 星期五

[Tech.] Hot-Bar FPC Design Notices

The Hot-Bar reflow is a selective soldering process where connect two pre-fluxed, solder coated parts by heating element (call a thermode) with proper temperature to melt the solder.

Applying a pressure on the soldering target is necessary to melt the solder and insure that components stay in place during cooling.

The regular Hot-Bar reflow process is to pre-print the solder paste on the PCB then go SMT reflow with other SMD components. After that then stick the FPC on the board and melt the solder again through thermode to connect the FPC on board.

In order to mount FPC on PCB, a thermal-conductor inside FPC to transfer heat from thermode to PCB to melt the printed solder on PCB is necessary.

HotBar02s <-- Thermode


The common conductor inside FPC is building Plating hole (PTH) on contact finger of FPC as below sketch. Three PTHs on each contact finger are preferable. One half-circle via + two circle vias can be acceptable if there is no space for three completed vias.
HotBar_PTH_thumb1

It is necessary to apply double adhesive to fix FPC on board during Hot-Bar reflow process. No body like to take the hot touch risk to hold FPC on PCB for Hot Bar process.

To summary the requirements for Hot-Bar FPC:

  • 3 PTHs on Hot-Bar finger.
  • Double adhesive at near side to stick flex cable on PCB before Hot Bar process. The thickness should be less than 0.15mm and leave 0.2mm space from Hot-Bar terminal. 

Hot-Bar PCB pattern size should be designed as below to prevent solder short between patterns while thermode press down.

HotBar_cable_pitch_thumb

 

In order to prevent FPC from broken at solder finger edge. It is recommended to make different cover films (polymide) with various length end to fix the stress concentration issue. Detail recommended structure show as below.

hotbar_flex_cable1_thumb5


The recommended components distance from Hot-Bar land pattern:

  • The minimum distance from components to front side of FPC is 2mm.
  • The minimum distance from components to both sides of PCB is 3mm.
  • The minimum distance from PCB edge to contact pads of FPC is 5mm. (This 5mm is for double adhesive tape purpose)
  • The minimum distance from components to contact pads under FPC is 10mm. (This 10mm is for double adhesive tape fixing on PCB)

HotBar_PCB_thumb1


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